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Electrical TCAD Simulations of a Germanium pMOSFET Technology

机译:锗pMOSFET技术的电气TCAD仿真

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摘要

A commercial technology computer-aided design device simulator was extended to allow electrical simulations of sub-100-nm germanium pMOSFETs. Parameters for generation/recombination mechanisms (Shockley–Read–Hall, trap-assisted tunneling, and band-to-band tunneling) and mobility models (impurity scattering and mobility reduction at high lateral and transversal field) are provided. The simulations were found to correspond well with the experimental $I$– $V$ data on our Ge transistors at gate lengths down to 70 nm and various bias conditions. The effect of changes in halo dose and extension energies is discussed, illustrating that the set of models presented in this paper can prove useful to optimize and predict the performance of new Ge-based devices.
机译:扩展了商用技术的计算机辅助设计设备模拟器,以允许对100纳米以下的锗pMOSFET进行电仿真。提供了生成/重组机制(Shockley-Read-Hall,陷阱辅助隧穿和带间隧穿)的参数和迁移率模型(杂质在高横向和横向场的散射和迁移率降低)。发现仿真与栅极长度低至70 nm以及各种偏置条件下我们的Ge晶体管上的实验$ I $ – $ V $数据非常吻合。讨论了晕圈剂量和扩展能量变化的影响,表明本文介绍的一组模型可以证明对优化和预测新型Ge基器件的性能很有用。

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