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首页> 外文期刊>IEEE Electron Device Letters >p-MOSFET and n-MOSFET Prepared by ICP-Assisted Hot Wire Implantation Doping Technique
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p-MOSFET and n-MOSFET Prepared by ICP-Assisted Hot Wire Implantation Doping Technique

机译:ICP辅助热线注入掺杂技术制备的p-MOSFET和n-MOSFET

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摘要

In this letter, p-type and n-type metal-oxide- semiconductor field-effect transistors (MOSFETs) were fabricated using an inductively coupled plasma-assisted hot wire implantation doping technique. A complementary metal-oxide- semiconductor (CMOS) device that combines pand n-MOSFETs was also fabricated. The obtained junction depth of the p-MOSFETs was ~45 nm. The subthreshold slope and ON-OFF current ratio of the p-MOSFET were ~0.18 V/decade and over 104, respectively. The measurements made of the CMOS device show that it is a good inverter.
机译:在这封信中,使用感应耦合等离子体辅助热线注入掺杂技术制造了p型和n型金属氧化物半导体场效应晶体管(MOSFET)。还制造了一个将金属n-MOSFET组合在一起的互补金属氧化物半导体(CMOS)器件。所获得的p-MOSFET的结深度为〜45 nm。 p-MOSFET的亚阈值斜率和ON-OFF电流比分别为〜0.18 V / decade和超过104。对CMOS器件的测量表明,它是一个很好的反相器。

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