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首页> 外文期刊>IEEE Electron Device Letters >In-Operando Spatial Imaging of Edge Termination Electric Fields in GaN Vertical p-n Junction Diodes
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In-Operando Spatial Imaging of Edge Termination Electric Fields in GaN Vertical p-n Junction Diodes

机译:GaN垂直p-n结二极管中边缘终止电场的操作中空间成像

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摘要

Control of electric fields with edge terminations is critical to maximize the performance of high-power electronic devices. While a variety of edge termination designs have been proposed, the optimization of such designs is challenging due to many parameters that impact their effectiveness. While modeling has recently allowed new insight into the detailed workings of edge terminations, the experimental verification of the design effectiveness is usually done through indirect means, such as the impact on breakdown voltages. In this letter, we use scanning photocurrent microscopy to spatially map the electric fields in vertical GaN p-n junction diodes in operando. We reveal the complex behavior of seemingly simple edge termination designs, and show how the device breakdown voltage correlates with the electric field behavior. Modeling suggests that an incomplete compensation of the p-type layer in the edge termination creates a bilayer structure that leads to these effects, with variations that significantly impact the breakdown voltage.
机译:用边缘终端控制电场对于最大化高功率电子设备的性能至关重要。尽管已经提出了各种边缘终端设计,但是由于许多影响其有效性的参数,这种设计的优化是具有挑战性的。虽然建模最近允许人们对边缘终端的详细工作有了新的认识,但设计有效性的实验验证通常是通过间接方式进行的,例如对击穿电压的影响。在这封信中,我们使用扫描光电流显微镜在操作中对垂直GaN p-n结二极管中的电场进行空间映射。我们揭示了看似简单的边缘端接设计的复杂行为,并展示了器件击穿电压与电场行为之间的关系。建模表明,边缘终端中p型层的不完全补偿会产生导致这些效应的双层结构,其变化会显着影响击穿电压。

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