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首页> 外文期刊>IEEE Electron Device Letters >Analysis of Improved Performance Under Negative Bias Illumination Stress of Dual Gate Driving a-IGZO TFT by TCAD Simulation
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Analysis of Improved Performance Under Negative Bias Illumination Stress of Dual Gate Driving a-IGZO TFT by TCAD Simulation

机译:TCAD仿真分析双栅极驱动a-IGZO TFT负偏压照明下的改善性能。

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摘要

We report the numerical simulation of the effect of a dual gate (DG) TFT structure operating under dual gate driving on improving negative bias illumination stress (NBIS) of amorphous indium gallium zinc oxide thin-film transistors (a-IGZO TFTs). With respect to the transfer characteristics of a-IGZO TFTs, we show a larger negative threshold voltage shift (ΔVTH) with increasing a-IGZO active layer thickness. This trend is confirmed by TCAD simulation, where the initial transfer curve is plotted under varying a-IGZO thickness keeping a constant density of states. Under varying a-IGZO thickness, TCAD simulation results confirm TFTs under DG driving shows significantly less ΔVTH shift under NBIS compared with that of single gate (SG) driving TFTs. Under 10 K seconds of NBIS, TCAD simulation results show the increase in donor-like states (NGD) by 5.25 × 1017 cm-3 eV-1 and acceptor-like states (NGA) by 7.5 × 1016 cm-3 eV-1.
机译:我们报告了在双栅极驱动下操作的双栅极(DG)TFT结构对改善非晶铟镓锌氧化物薄膜晶体管(a-IGZO TFT)的负偏压照明应力(NBIS)的影响的数值模拟。关于a-IGZO TFT的传输特性,随着a-IGZO有源层厚度的增加,我们显示出更大的负阈值电压偏移(ΔVTH)。这种趋势已通过TCAD仿真得到了证实,其中初始转移曲线是在变化的a-IGZO厚度下绘制的,并保持恒定的状态密度。在变化的a-IGZO厚度下,TCAD仿真结果证实,与单栅(SG)驱动TFT相比,在DGIS驱动下的TFT在NBIS下显示的ΔVTH漂移小得多。在NBIS的10 K秒下,TCAD仿真结果表明,供体样态(NGD)增加了5.25×1017 cm-3 eV-1,而受体样态(NGA)增加了7.5×1016 cm-3 eV-1。

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