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Properties of RF Magnetron-Sputtered Copper Gallium Oxide (CuGa2O4) Thin Films

机译:RF磁控溅射铜镓氧化物(Cuga2O4)薄膜的性质

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Thin films of CuGa2O4 were deposited using an RF magnetron-sputtering technique for the first time. The sputtered CuGa2O4 thin films were post-deposition annealed at temperatures varying from 100 to 900 °C in a constant O2 ambience for 1.5 h. Structural and morphological studies were performed on the films using X-ray diffraction analysis (XRD) and a Field Emission Scanning Electron Microscope (FESEM). The presence of CuGa2O4 phases along with the CuO phases was confirmed from the XRD analysis. The minimum critical temperature required to promote the crystal growth in the films was identified to be 500 °C using XRD analysis. The FESEM images showed an increase in the grain size with an increase in the annealing temperature. The resistivity values of the films were calculated to range between 6.47 × 103 and 2.5 × 108 ?cm. Optical studies were performed on all of the films using a UV-Vis spectrophotometer. The optical transmission in the 200–800 nm wavelength region was noted to decrease with an increase in the annealing temperature. The optical bandgap value was recorded to range between 3.59 and 4.5 eV and showed an increasing trend with an increase in the annealing temperature.
机译:首次使用RF磁控溅射技术沉积Cuga2O4的薄膜。溅射的Cuga2O4薄膜在恒定O2氛围中在100至900℃下在100至900℃下的温度下退火。使用X射线衍射分析(XRD)和场发射扫描电子显微镜(FESEM)对薄膜进行结构和形态学研究。从XRD分析中确认Cuga2O4相和CuO相的存在。促进薄膜中晶体生长所需的最小临界温度使用XRD分析鉴定为500℃。 FESEM图像显示晶粒尺寸的增加随着退火温度的增加。将薄膜的电阻率值计算为6.47×103和2.5×108Ω厘米的范围。使用UV-Vis分光光度计对所有薄膜进行光学研究。 200-800nm波长区域中的光学传输被注意到退火温度的增加随着退火温度的增加而降低。光学带隙值被记录为3.59和4.5 eV之间的范围,并在退火温度增加时显示出增加的趋势。

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