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A density functional theory study on the interface stability between CsPbBr3 and CuI

机译:CSPBBR3和CUI界面稳定性的密度泛函理论研究

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This paper assesses the interface stability of the perovskite CsPbBrsub3/sub and transport layer CuI using density functional theory and band offset calculations. As a low-cost, more stable alternative to current hole transport materials, CuI may be used to template the epitaxial growth of perovskites such as CsPbBrsub3/sub owing to a 1% lattice constant mismatch and larger bulk modulus. We compare all eight atomic terminations of the interfaces between the (100) low-energy facet for both CsPbBrsub3/sub and CuI, increasing material thickness to consider charge density redistribution and bonding characteristics between surface and bulk-like regions. A low energy atomic termination is found to exist between these materials where alternating charge accumulation and depletion regions stabilize bonds at the interface. Band offset calculations reveal a type I straddling gap offset in the bulk shifting to a type II staggered gap offset as the thickness of the materials is increased, where the built-in potential changes as layer thickness increases, indicating the tunability of charge separation at the interface. CuI may, thus, be used as an alternative hole transport layer material in CsPbBrsub3/sub optoelectronic devices.
机译:本文评估了使用密度泛函理论和带偏移计算的Perovskite CSPBBR 3 和传输层Cui的界面稳定性。作为电流空穴传输材料的低成本,更稳定的替代方案,CUI可用于模板由于1%晶格恒定错配和较大的体积模量而模板诸如Cspbbr 3 的钙钛矿的外延生长。我们将所有八个原子终端进行了CSPBBR 3 和CUI之间(100)低能量面之间的界面的所有八个原子终端,增加了材料厚度,以考虑表面和散装区域之间的电荷密度再分配和粘接特性。发现低能量原子终端存在于这些材料之间存在,其中交替电荷积聚和耗尽区稳定在界面处的键。带偏移计算显示,随着材料的厚度增加,随着材料的厚度增加,在厚度的情况下,随着材料的厚度,内置电位变化,表示电荷分离的可调性在散装偏移中的II型散热偏移。界面。因此,CUI可以用作CSPBBR 3 光电器件中的替代空穴传输层材料。

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