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Improvement of Electrical Device Performances for Graphene Directly Grown on a SiO2 Substrate by Plasma Chemical Vapor Deposition

机译:通过等离子化学气相沉积改善直接生长在SiO2衬底上的石墨烯的电气器件性能

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The electrical device performances of graphene directly grown on a SiO2 substrate have been improved through the precise adjustment of growth conditions such as growth temperature and growth time in plasma chemical vapor deposition (CVD). Only at the suitable combination of growth time and temperature, high quality and uniform graphene sheet can be directly grown on a SiO2 substrate. Forward and reverse sweeps of source-drain current ( I ds) vs. gate bias voltage ( V gs) showed small hysteresis, possibly caused by the clean surface of the graphene device fabricated by plasma CVD, a technique that did not involve any transfer. Four-point probe measurements to evaluate the intrinsic sheet resistance of the fabricated graphene showed its value to be 170 - 200 Ω/sq, a value much lower than that of graphene directly grown on SiO2 substrate by other techniques. This low sheet resistance possibly originated from the high quality of graphene obtained by plasma CVD. These observations suggest that graphene directly grown on SiO2 substrate by plasma CVD should be a very promising candidate for fabrication of graphene-based high-performance electrical devices.
机译:通过精确调整生长条件,例如等离子体化学气相沉积(CVD)中的生长温度和生长时间,可以改善直接在SiO 2 衬底上生长的石墨烯的电子器件性能。只有在适当的生长时间和温度组合下,才能在SiO 2 衬底上直接生长高质量且均匀的石墨烯片。源极漏极电流(I ds )与栅极偏置电压(V gs )的正向和反向扫描显示出较小的磁滞现象,这可能是由于石墨烯器件表面清洁引起的由等离子CVD制造的技术,该技术不涉及任何转移。通过四点探针测量来评估制成的石墨烯的固有薄层电阻,结果表明其值为170-200Ω/ sq,该值远低于直接在SiO 2 衬底上生长的石墨烯的值。技术。该低的薄层电阻可能源自通过等离子体CVD获得的高质量的石墨烯。这些观察结果表明,通过等离子体CVD直接在SiO 2 衬底上生长的石墨烯应该是制造基于石墨烯的高性能电气器件的非常有前途的候选者。

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