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Operating the HIPIMS discharge with ultra-short pulses: a solution to overcome the deposition rate limitation

机译:使用超短脉冲操作HIPIMS放电:克服沉积速率限制的解决方案

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This study presents results on the influence of pulse duration in HiPIMS discharge on the sputtering mechanisms, target-to-substrate particles transport, and deposition rate. A copper disk-shaped target was sputtered in argon atmosphere, increasing the pulse duration from 3 μs to 50 μs and adjusting the pulsing frequency in order to keep a constant average power of 100 W. Voltage and current waveforms, time-resolved fast imaging, time resolved-optical emission spectroscopy, time evolution of the ion flux towards the substrate, and energy-resolved mass spectrometry were used in order to investigate the plasma composition and its change in front of the target. Increasing the pulse duration, the sputtering mechanism is gradually transformed from dominant gas sputtering to self-sputtering driven mode and the deposition rate decreases.
机译:这项研究提出了有关HiPIMS放电中脉冲持续时间对溅射机理,靶到基底颗粒传输以及沉积速率的影响的结果。在氩气中溅射铜盘状靶,将脉冲持续时间从3μs增加到50μs,并调整脉冲频率,以保持恒定的100 W平均功率。电压和电流波形,时间分辨快速成像,为了研究等离子体成分及其在靶材前面的变化,使用了时间分辨光发射光谱法,离子流向基板的时间演化以及能量分辨质谱法。随着脉冲持续时间的增加,溅射机理逐渐从占优势的气体溅射转变为自溅射驱动模式,沉积速率降低。

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