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Characteristics and Breakdown Behaviors of Polysilicon Resistors for High Voltage Applications

机译:高压应用的多晶硅电阻器的特性和击穿行为

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With the rapid development of the power integrated circuit technology, polysilicon resistors have been widely used not only in traditional CMOS circuits, but also in the high voltage applications. However, there have been few detailed reports about the polysilicon resistors’ characteristics, like voltage and temperature coefficients and breakdown behaviors which are critical parameters of high voltage applications. In this study, we experimentally find that the resistance of the polysilicon resistor with a relatively low doping concentration shows negative voltage and temperature coefficients, while that of the polysilicon resistor with a high doping concentration has positive voltage and temperature coefficients. Moreover, from the experimental results of breakdown voltages of the polysilicon resistors, it could be deduced that the breakdown of polysilicon resistors is thermally rather than electrically induced. We also proposed to add an N-type well underneath the oxide to increase the breakdown voltage in the vertical direction when the substrate is P-type doped.
机译:随着功率集成电路技术的飞速发展,多晶硅电阻器不仅在传统的CMOS电路中,而且在高压应用中也得到了广泛的应用。但是,关于多晶硅电阻器特性的详细报道很少,例如电压和温度系数以及击穿行为是高压应用的关键参数。在本研究中,我们通过实验发现,掺杂浓度相对较低的多晶硅电阻器的电阻具有负电压和温度系数,而掺杂浓度较高的多晶硅电阻器的电阻具有正电压和温度系数。而且,从多晶硅电阻的击穿电压的实验结果可以推断出,多晶硅电阻的击穿是热的而不是电的。我们还建议在氧化物下方添加一个N型阱,以在衬底被P型掺杂时增加垂直方向的击穿电压。

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