Health Monitoring for Damage Initiation and Progression During Mechanical Shock in Electronic Assemblies

摘要

Electronic products may be subjected to shock and vibration during shipping, normal usage, and accidental drop. High strain rate transient bending produced by such loads may result in failure of fine pitch electronic interconnects. Current experimental techniques rely on electrical resistance for determination of failure. Significant advantage can be gained by prior knowledge of impending failure for applications where the consequences of system failure may be catastrophic. This research effort focuses on an alternate approach to damage quantification in electronic assemblies subjected to shock and vibration, without testing for electrical continuity. The proposed approach can be extended to monitor product level damage.