Plating High Aspect Ratio Blind Vias

摘要

Blind vias with aspect ratios over 1:1 can allow vastly increased densities on panels, thereby reducing their size. Additionally, the ability to connect L1-L3, or L1-L2-L3 can reduce the layer counts for a conventional, similarly functional board. The advantages of high aspect ratio blind vias have yet to be fully realized by printed circuit board designers due to limitations in the ability to metallize and plate them.