Properties of new printed circuit board base materials

摘要

Currently, the most widely used Printed Circuit Board (PCB) base material is the glass reinforced epoxy known as FR-4. To improve the electrical or the thermomechanical performance of PCBs, there are two possibilities from a material standpoint: a modification or change of the resin system and a change of the reinforcement. Currently, there are a number of resins used for high performance PCB base materials. These resin systems offer higher Tgs and lower z-axis-expansions for improved through hole reliability. Non-halogenated epoxy resin systems are offered for the production of green PCBs.