Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

Baszynski Michal; Ramotowski Edward; Ostaszewski Dariusz; Klej Tomasz; Wojcik Mariusz; Kohvakka Mikko; Kamari Anssi

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Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

机译：评估具有改进散热性能的印刷电路板新技术和新材料

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Purpose - The purpose of this paper is to evaluate thermal properties of printed circuit board (PCB) made with use of new materials and technologies.

机译：目的-本文的目的是评估使用新材料和新技术制成的印刷电路板（PCB）的热性能。

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来源
《Circuit World》 |2016年第1期|32-36|共5页
作者
Baszynski Michal; Ramotowski Edward; Ostaszewski Dariusz; Klej Tomasz; Wojcik Mariusz; Kohvakka Mikko; Kamari Anssi;
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作者单位

ABB Corp Res Ctr, Krakow, Poland;

Tele & Radio Res Inst, Warsaw, Poland;

Tele & Radio Res Inst, Warsaw, Poland;

Tele & Radio Res Inst, PCB Innovat Ctr, Warsaw, Poland;

ABB Corp Res Ctr, Krakow, Poland;

ABB Drives Oy, Helsinki, Finland;

ABB Drives Oy, Helsinki, Finland;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类
关键词
PCB; Heat dissipation; PCB technology; PCB thermal management;

机译：PCB;散热;PCB技术;PCB热管理;

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1. Fabrication of Al-Based Metal Printed Circuit Board Having Excellent Heat Dissipation Characteristics Using Polyimide/AlN Powder and Evaluation of Thermal Resistance of Light-Emitting Diode Module [J] . Park Jung-Kab, Baek Seung-Bin, Park Jong-Hwan, Journal of nanoscience and nanotechnology . 2016,第10期

机译：聚酰亚胺/ AlN粉制备具有优良散热性能的铝基金属印制板及其发光二极管模块的热阻评估
2. Heat Dissipation Performance of Metal Core Printed Circuit Board with Micro Heat Exchanger [J] . Diancheng Qin, Kewei Liang 哈尔滨工业大学学报（英文版） . 2020,第001期

机译：带有微型热交换器的金属芯印刷电路板的散热性能
3. Design Method and Material Technologies for Passives in Printed Circuit Board Embedded Circuits [J] . Eberhard Waffenschmidt, Bernd Ackermann, J. A. Ferreira IEEE Transactions on Power Electronics . 2005,第3期

机译：印刷电路板嵌入式电路中无源元件的设计方法和材料技术
4. A method to evaluate effects of moisture absorption on dielectric constant and dissipation factor of printed circuit board materials [C] . Heinola, J.-M., Latti, . 2004

机译：一种评估吸湿率对印刷电路板材料介电常数和损耗因子的影响的方法
5. Determining improved drilling parameters and materials for Teflon printed circuit boards that include fluorinated ethylene propylene (FEP) [D] . Webster, Donald Frederic 2012

机译：为包括氟乙丙烯（FEP）的特氟龙印刷电路板确定改进的钻孔参数和材料
6. Screen-printed electrode produced by printed-circuit board technology. Application to Cancer Biomarker Detection by means of plastic antibody as sensing material [O] . Felismina T.C. Moreira, M. Judite M.S. Ferreira, José R.T. Puga, -1

机译：通过印刷电路板技术生产的丝网印刷电极。以塑料抗体为检测材料在癌症生物标志物检测中的应用
7. Special Articles: The Problem of Evaluation of Insulation Reliability for Printed Circuit Boards. Measurement Techniques of Dielectric Characteristics Suitable for Electrical Insulating Materials Used for Printed Circuit Boards and Their Application to the Estimation of Reliability on Insulation Properties. [O] . Eiki WATANABE 1995

机译：特殊文章：印刷电路板绝缘可靠性评价问题。适用于用于印刷电路板的电绝缘材料的介电特性的测量技术及其在绝缘性能估计的应用中的应用。

Evaluation of new technologies and materials for printed circuit boards with improved heat dissipation properties

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