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A Compact Ultra-wideband Bandpass Filter Withultra-fine Conductor Trace Based On Liquidrncrystal Polymer Substrates

机译:基于液晶聚合物基底的具有超细导体痕迹的紧凑型超宽带带通滤波器

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Purpose - Liquid Crystal Polymer (LCP) materials are considered to be promising substrates for wireless applications because of their excellentrnproperties. The purpose of this paper is to describe now a novel and compact microstrip ultra-wideband bandpass filter (UWB BPF) with ultra-finernconductor traces working over 22 to 29 GHz is fabricated on LCP substrates.rnDesign/methodology/approach - Using standard processing technology, such as photolithography, plasma pretreatment, sputter deposition andrnwet etching, a microstrip UWB BPF is fabricated on LCP substrates. In order to obtain better adhesion between LCP substrate and copper, the oxygenrnplasma pretreatment of the LCP substrate surface and a thin titanium adhesion layer are introduced before a copper layer is sputter-deposited onto thernsubstrate.rnFindings - The measured and the simulated results agree well. The measured insertion loss is about 8 dB in the passband of the bandpass filter, whichrnis a little high compared to the simulated result (~5 dB). The out of band performance at both the high frequency and low frequency is very good,rnalmost higher than 35 dB.rnOriginality/value - This paper presents the realization of (UWB BPF) working over 22 to 29 GHz based on an LCP substrate, which demonstrates thernfeasibility of the application of the LCP substrate in RF wireless systems and also gives some useful information for later research.
机译:目的-液晶聚合物(LCP)材料由于其优异的性能而被认为是有前途的无线应用基板。本文的目的是描述一种新型的紧凑型微带超宽带带通滤波器(UWB BPF),该器件在LCP衬底上制造了工作在22至29 GHz范围内的超导走线。rn设计/方法/方法-使用标准处理技术例如光刻,等离子预处理,溅射沉积和非水蚀刻,在LCP基板上制作了微带UWB BPF。为了在LCP基板和铜之间获得更好的附着力,在将铜层溅射沉积到rn基板上之前,先进行LCP基板表面的氧等离子体预处理和薄的钛附着层。rn发现-测量结果与模拟结果吻合良好。在带通滤波器的通带中测得的插入损耗约为8 dB,与模拟结果(〜5 dB)相比,该损耗略高。高频和低频下的带外性能都非常好,几乎高于35 dB。rnOriginity / value-本文介绍了基于LCP基板的工作在22至29 GHz的(UWB BPF)实现。演示了将LCP基板应用于RF无线系统的可行性,并为以后的研究提供了一些有用的信息。

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