机译:一种新颖的集成电路倒装芯片互连工艺
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK;
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK;
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK;
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, UK;
flip-chip; interconnections; electrophoretic deposition; integrated circuits; polymers; electrodeposition;
机译:高压退火工艺对大规模集成电路铜互连回流现象的影响
机译:集成探测器,用于在电路板,模块和集成电路上的嵌入式光学互连
机译:集成探测器,用于在电路板,模块和集成电路上的嵌入式光学互连
机译:各种集成电路互连设计的过程诱导损坏 - 实用集成电路布局实践下天线规则的限制
机译:用于集成电路内部互连的扩展气隙的材料,工艺和特性
机译:单粒门 - 全围绕单片三维集成电路的低热预算过程的Si纳米线FET
机译:回顾Marconi ud使用的倒装GaAs电路,模型,互连和建模技术
机译:在稀HF溶液中铝,al-Cu和al-si薄膜的亚稳态点腐蚀及其与集成电路互连处理的相关性。