Soldering technology for small parts presents hitches, opportunities: The degree of difficulty in parts mounting increases as chip parts become smaller and soldering defects are produced more frequently

摘要

Global industries have recognized lead-free electronic device mounting as a technical field where Japanese industries are taking the lead. Advances in this technology notwithstanding, 2004 is not a terminal year for the evolution of lead-free electronic device mounting technology. The characteristics of lead-free soldering paste are being continually improved. Production lines are shifting from the conventional lead-containing solder to lead-free solder. At present, one of the hottest topics include the evolution of heating capability of the reflow system, and the dipping and corrosion of stainless steel in the wave soldering system.