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Ageing Behaviour of Sc-Doped Cu-Zn-Al Shape Memory Alloys

机译:Sc掺杂Cu-Zn-Al形状记忆合金的时效行为

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摘要

The effect of scandium (Sc), when added in trace, on the ageing behaviour of Cu-Zn-Al shape memory alloy was investigated in the present work. Cu-Zn-Al shape memory alloy was prepared by melting 70:30 brass using commercial grade Cu strips and Al chips. Sc was added using Al-Sc 2wt% master alloy at the time of melting, and the final composition was adjusted to 0.1wt% Sc. Chemical composition of the alloys was analysed by using EDAX and spectrometer. The influence of Sc on mechanical properties under different ageing conditions were primarily evaluated by Vickers hardness test. Optical and scanning electron microscopy (SEM) was used to analyse the microstructure. Differential scanning calorimetry was used to measure the transformation temperatures, correspond to martensite to austenite or the reverse transformation. Thermo-Calc software was used to construct a phase fraction diagram as a function of temperature to obtain the evolving phases during quenching and subsequent ageing process for both of the alloy systems. The ageing behaviour was also examined using XRD and SEM characterization and explained in the light of phase predictions obtained from the thermodynamic calculations. Subsequently, transmission electron microscopy investigation was carried out to evaluate the influence of Sc on the size and habit planes of the precipitates in Cu-Zn-Al ternary alloy system. Sc has been found to reduce the transformation temperature and consequently increase the mobility of the martensite/austenite interface.
机译:在本工作中,研究了微量添加added(Sc)对Cu-Zn-Al形状记忆合金的时效行为的影响。 Cu-Zn-Al形状记忆合金是通过使用商品级的Cu条和Al片将70:30的黄铜熔化而制成的。在熔融时使用2重量%的Al-Sc中间合金添加Sc,将最终组成调整为0.1重量%的Sc。通过使用EDAX和光谱仪分析合金的化学组​​成。主要通过维氏硬度试验评估Sc对不同时效条件下机械性能的影响。使用光学和扫描电子显微镜(SEM)来分析显微结构。差示扫描量热法用于测量相变温度,对应于马氏体至奥氏体或反向相变。使用Thermo-Calc软件构建随温度变化的相分数图,以获得两种合金系统在淬火和后续时效过程中的发展相。还使用XRD和SEM表征检查了老化行为,并根据从热力学计算获得的相预测进行了解释。随后,进行了透射电子显微镜研究,以评估Sc对Cu-Zn-Al三元合金体系中析出物的尺寸和习性平面的影响。已经发现Sc降低了相变温度并因此增加了马氏体/奥氏体界面的迁移率。

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