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Effect of sulfurization temperature on the phase purity of Cu_2SnS_3 thin films deposited via high vacuum sulfurization

机译:硫化温度对高真空硫化沉积Cu_2SnS_3薄膜相纯度的影响

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In this study, the deposition of Cu2SnS3 (CTS) thin films was carried out at different sulfurization temperatures in the range of 350-550 degrees C under high vacuum of 1 Pa using the sputtered Cu/Sn/Cu metal precursor layers in the sulfur vapor atmosphere. In order to reduce the Sn loss, a particular metal stack of Cu/Sn/Cu was used. Single phase monoclinic (M)-CTS thin film was obtained at 500 degrees C. The high intensity Raman modes at 292 cm(-1) and 350 cm(-1) further confirmed the formation of M-CTS. The M-CTS thin film sulfurized at 500 degrees C showed a composition of Cu/Sn = 1.89 and an optical band gap energy of 0.94 eV. Hall effect measurement of the film sulfurized at 500 degrees C with Cu/Sn ratio of 1.82 showed an electrical resistivity of 7.30 Omega-cm, carrier concentration of 6.29 x 10(17) cm(-3), and mobility of 1.36 cm(2) /Vs. Our results indicate that the copper-poor composition with a stacking order of Cu/Sn/Cu is favored in order to attain the single phase M-CTS.
机译:在这项研究中,Cu2SnS3(CTS)薄膜的沉积是在硫磺蒸气中溅射的Cu / Sn / Cu金属前体层在1 Pa的高真空下于350-550℃范围内的不同硫化温度下进行的。大气层。为了减少Sn损失,使用了特定的Cu / Sn / Cu金属叠层。在500摄氏度下获得单相单斜(M)-CTS薄膜。在292 cm(-1)和350 cm(-1)处的高强度拉曼模式进一步证实了M-CTS的形成。在500℃下硫化的M-CTS薄膜的成分为Cu / Sn = 1.89,光学带隙能量为0.94 eV。在500摄氏度下硫化铜/锡比为1.82的薄膜的霍尔效应测量显示,电阻率为7.30Ω-cm,载流子浓度为6.29 x 10(17)cm(-3),迁移率为1.36 cm(2) )/ Vs。我们的结果表明,为了获得单相M-CTS,具有Cu / Sn / Cu堆积顺序的贫铜组合物是有利的。

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