Manufacturability of superconductor electronics for a petaflops-scale computer

摘要

Ultra-low power and ultra-high speed single-flux-quantum electronics is an enabling near-term technology solution for petaflops-scale computers. The proposed Hybrid Technology Multi-threaded (HTMT) petaflops computer architecture includes computational modules operating at 100 GHz and an I/O throughput of 32 Petabits/s. Due to fundamental time-of-flight and power dissipation limitations of semiconductor ICs, superconductor ICs at an integration level of 100 k gates/cm/sup 2/ are proposed for the HTMT computation modules. In this paper, we discuss the manufacturability of superconductor-based computation modules, including the IC foundry process, packaging, and data link out of the cryopackage. We focus on the critical technical challenges that exist in each of these areas and present a technology roadmap to achieve the HTMT requirements.