首页> 外文期刊>Applied Physicsletters >Thermal rectification at water/functionalized silica interfaces
【24h】

Thermal rectification at water/functionalized silica interfaces

机译:水/功能化二氧化硅界面的热精馏

获取原文
获取原文并翻译 | 示例
           

摘要

Using nonequilibrium molecular dynamics simulations, we study the thermal diode effect in a system composed of silica, self-assembled monolayers (SAMs) at the silica surface and water surrounding this system, by imposing a series of positive and negative heat currents. We have found that in the limit of large heat currents, the thermal conductance at the SAMs-water interface is about 1000 MW/m~2 K at room temperature for heat flowing from the SAMs to the water and 650 MW/m~2 K for heat flowing from the water to the SAMs, respectively, resulting in a thermal rectification of up to 54%. Analysis of the radial distribution function of oxygen-oxygen atoms in water indicates that the origin of the thermal rectification resides in the strong temperature dependence of the hydrogen bonds in water.
机译:通过使用非平衡分子动力学模拟,我们通过施加一系列正负热流,研究了由二氧化硅,二氧化硅表面的自组装单分子膜(SAMs)和该系统周围的水组成的系统中的热二极管效应。我们发现,在大热流的限制下,对于从SAMs到水的热流,室温下SAMs-水界面的热导约为1000 MW / m〜2 K,而650 MW / m〜2 K从水流到SAM的热量分别高达54%。对水中氧-氧原子的径向分布函数的分析表明,热精馏的起源在于水中氢键的强烈温度依赖性。

著录项

  • 来源
    《Applied Physicsletters》 |2009年第15期|151903.1-151903.3|共3页
  • 作者单位

    Department of Mechanical and Process Engineering, Laboratory of Thermodynamics in Emerging Technologies, Institute of Energy Technology, ETH Zurich, 8092 Zurich, Switzerland IBM Research GmbH, Zurich Research Laboratory, 8803 Rueschlikon, Switzerland;

    IBM Research GmbH, Zurich Research Laboratory, 8803 Rueschlikon, Switzerland;

    IBM Research GmbH, Zurich Research Laboratory, 8803 Rueschlikon, Switzerland;

    Department of Mechanical and Process Engineering, Laboratory of Thermodynamics in Emerging Technologies, Institute of Energy Technology, ETH Zurich, 8092 Zurich, Switzerland;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号