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Pinning of recombination-enhanced dislocation motion in 4H-SiC: Role of Cu and EH_1 complex

机译:4H-SiC中复合增强位错运动的固定:Cu和EH_1络合物的作用

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摘要

We report on the pinning of recombination-enhanced dislocation motion in 4H-SiC by the implantation of Cu. The Cu was found to be preferentially gettered at basal plane dislocations (BPDs). Both EH_1 and Z_(1/2) center were detected in 4H-SiC by cathodoluminescence. It was noticed that the EH_1 has high luminescence intensity at the central part of the BPDs, while the Z_(1/2) does not. The complex of Cu and EH_1 is regarded to be the cause for the pinning effect. The possible reason for the pinning is discussed.
机译:我们报告了通过注入铜来固定4H-SiC中复合增强位错运动的情况。发现铜优先吸附在基面位错(BPD)处。通过阴极发光在4H-SiC中检测到EH_1和Z_(1/2)中心。注意到EH_1在BPD的中心部分具有高发光强度,而Z_(1/2)则没有。 Cu和EH_1的络合物被认为是钉扎效应的原因。讨论了固定的可能原因。

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  • 来源
    《Applied Physicsletters》 |2010年第21期|P.212110.1-212110.3|共3页
  • 作者单位

    National Institute of Advanced Industrial Science and Technology, Tsukuba 305-8568, Japan;

    National Institute of Advanced Industrial Science and Technology, Tsukuba 305-8568, Japan;

    National Institute for Materials Science, Tsukuba 305-0044, Japan;

    rnNational Institute of Advanced Industrial Science and Technology, Tsukuba 305-8568, Japan;

    National Institute of Advanced Industrial Science and Technology, Tsukuba 305-8568, Japan;

    National Institute of Advanced Industrial Science and Technology, Tsukuba 305-8568, Japan;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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