Maze solving automatons for self-healing of open interconnects: Modular add-on for circuit boards

摘要

We present the circuit board integration of a self-healing mechanism to repair open faults. The electric field driven mechanism physically restores fractured interconnects in electronic circuits and has the ability to solve mazes. The repair is performed by conductive particles dispersed in an insulating fluid. We demonstrate the integration of the healing module onto printed circuit boards and the ability of maze solving. We model and perform experiments on the influence of the geometry of conductive particles as well as the terminal impedances of the route on the healing efficiency. The typical heal rate is 10μm/s with healed route having mean resistance of 8kΩ across a 200 micron gap and depending on the materials and concentrations used.