SELF-HEALING PRINTED CIRCUIT BOARD CAPABLE OF INCLUDING A MICROCAPSULE WHICH CONTAINS THE ADHESIVE MATERIAL INSIDE AN INSULATING LAYER, AND A SELF-HEALING METHOD THEREOF

摘要

PURPOSE: A self-healing printed circuit board capable of including a microcapsule and a self-healing method thereof are provided to implement an excellent mechanical intensity and chemical resistance on the printed circuit board, thereby preventing the haloing of the mechanical and chemical stimulation.;CONSTITUTION: A copper foil layer(20) is formed on the top of an insulating layer(10). A polyester resin film(30) is formed on the lower part of the insulating layer. Inside the insulating layer, at least one microcapsule(100) which contains the adhesive material(200) and a catalyst(300) are positioned. The insulating layer is an epoxy resin or a phenol resin. The microcapsule surrounds more than two nanocapsules.;COPYRIGHT KIPO 2013