Ball bond Shear Testing

摘要

The mainstay procedure for testing gold ball bonds in the semiconductor and microelectronics manufacturing industries has long been shear force methods that use chisel tools. Although the use of chisel tools for measuring the integrity of bonds between gold balls and their mating pad is generally considered reliable, it is not without its limitations. Specifically, the accuracy and quality of the bond strength test data can degrade when attempting to measure higher bond strengths, and the procedure is also highly sensitive to step-back height (the clearance between the tool tip and the bond substrate). Moreover, the maximum test force that can be successfully applied to a sample is often too small to produce a sufficient test resolution and an accurate measurement of bond strength and failure mode behavior.