As semiconductor packaging and board assembly converge

摘要

Throughout the electronics industry, new packaging technologies are driving changes in manufacturing. The drive to meet the needs of compact, lightweight products, such as cellular telephones, has resulted in packages that combine passive and active devices, analog and digital circuits, and even power components. This mixing of traditionally separate functions, and the ever-present packaging imperative - above all make it small - has lead to greater manufacturing challenges at every assembly level - wafer, component and board. We see new package technologies driving a convergence between the back-end packaging of components and the front end of the assembly process. This dynamic process presents a problem of vision for today's electronics manufacturer, because the change has blurred conventional boundaries and distinctions. From a technical point of view, we lose the distinction between components and assemblies. From a business standpoint, the boundary between the supplier and the customer becomes less clear. It is reasonable to assume that those boundaries will continue to blur until they are essentially gone.