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Effect of Dielectric and Liquid on Plasma Sterilization Using Dielectric Barrier Discharge Plasma

机译:介电和液体对介电势垒放电等离子体对等离子体灭菌的影响

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摘要

Plasma sterilization offers a faster, less toxic and versatile alternative to conventional sterilization methods. Using a relatively small, low temperature, atmospheric, dielectric barrier discharge surface plasma generator, we achieved ≥6 log reduction in concentration of vegetative bacterial and yeast cells within 4 minutes and ≥6 log reduction of Geobacillus stearothermophilus spores within 20 minutes. Plasma sterilization is influenced by a wide variety of factors. Two factors studied in this particular paper are the effect of using different dielectric substrates and the significance of the amount of liquid on the dielectric surface. Of the two dielectric substrates tested (FR4 and semi-ceramic (SC)), it is noted that the FR4 is more efficient in terms of time taken for complete inactivation. FR4 is more efficient at generating plasma as shown by the intensity of spectral peaks, amount of ozone generated, the power used and the speed of killing vegetative cells. The surface temperature during plasma generation is also higher in the case of FR4. An inoculated FR4 or SC device produces less ozone than the respective clean devices. Temperature studies show that the surface temperatures reached during plasma generation are in the range of 30°C–66°C (for FR4) and 20°C–49°C (for SC). Surface temperatures during plasma generation of inoculated devices are lower than the corresponding temperatures of clean devices. pH studies indicate a slight reduction in pH value due to plasma generation, which implies that while temperature and acidification may play a minor role in DBD plasma sterilization, the presence of the liquid on the dielectric surface hampers sterilization and as the liquid evaporates, sterilization improves.
机译:等离子灭菌是传统灭菌方法的一种更快,毒性更低且用途广泛的替代方法。使用相对较小的,低温,大气,介电屏障放电表面等离子体发生器,我们在4分钟内将营养细菌和酵母细胞的浓度降低了≥6log,在20分钟内实现了嗜热地热芽孢杆菌孢子的≥6log降低。血浆灭菌受多种因素影响。在此特定论文中研究的两个因素是使用不同介电基片的效果以及介电表面上液体量的重要性。注意,在测试的两种介电基板(FR4和半陶瓷(SC))中,就完全灭活而言,FR4效率更高。 FR4在产生血浆方面效率更高,如频谱峰值的强度,产生的臭氧量,使用的功率和杀死营养细胞的速度所示。对于FR4,等离子体产生期间的表面温度也较高。接种的FR4或SC设备产生的臭氧要少于相应的清洁设备。温度研究表明,在等离子体产生过程中达到的表面温度范围为30°C–66°C(对于FR4)和20°C–49°C(对于SC)。接种设备产生等离子体期间的表面温度低于清洁设备的相应温度。 pH研究表明,由于等离子体的产生,pH值会略有降低,这意味着虽然温度和酸化作用可能会在DBD等离子体灭菌中发挥较小的作用,但电介质表面上存在的液体会阻碍灭菌,并且随着液体的蒸发,灭菌效果会得到改善。

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