With the development of electronic systems and larger scale of system integration, heat elimination becomes more serious. Since system-level thermal design is less studied, the research on electronic shelter thermal design is of great significance to the%随着电子系统的发展,系统集成化程度的不断加剧,由此引发的散热问题越来越多。针对系统级热设计研究较少的情况,研究电子方舱的热设计问题有着重要意义。结合工程实践介绍了电子方舱系统的总体设计方案,对方舱热源进行分析,提出了热问题,并给出了解决方案,运用ICEPAK软件对系统进行建模仿真,仿真结果和实际应用情况的对比分析,显示出设计阶段预分析的有效性。
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