谈铝基双面、多层印制板工艺技术

摘要

随着LED向大功率照明方向发展，其散热问题日渐突出，已成为LED行业的难题，必须从导热材料、散热结构等多方面考虑加以解决。本文主要介绍双面、多层铝基板散热技术及工艺流程。%With the development of high-power LED lighting direction, the thermal issues have become increasingly prominent, and have become the LED industry problem. From the thermally conductive material, thermal structure, and many other considerations are to be addressed. This paper describes a multi-layer aluminum plate cooling technology and process technology.