器件尺寸正在对半导体加工工艺从多方面提出新的挑战.对于在90nm节点之后的应用,需要更大改进,且用适应性强的先进工艺来克服更大节点工艺中已得到验证的固有技术的限制.不仅基于先进工艺控制(APC)的下一代工艺设备能够得到来自一个以上信息来源的测量数据,而且将这些测量数据转换成为工艺控制参数以减少性能变化,下一代工艺设备必须提供生产线许多表明圆片经过工艺设备的整个控制程序特性.这种先进工艺控制系统将给予生产线高度理想的、适合先进工艺控制的适应能力需求,实现对其独特的生产线提供最大的优势.%Device scaling is posing new challenges for many aspects of semiconductor processing. More sophisticated and flexible advanced process controls (APC) are needed for sub-90-nm applications to overcome limitations inherent in techniques that have proven effective for larger nodes. Not only must next-generation process-tool-based APC systems be able to receive metrology data from more than one source and translate them into process-control parameters to reduce performance variations, they must provide the fab host with features for designating the entire process control sequence for wafers passing through the system. Such APC systems will give fabs the highly desirable versatility needed for tailoring APC implementation to best advantage for its particular production lines.
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