金属微通道结构UV-LIGA精密成形技术研究

摘要

随着宽禁带功率芯片的使用, 电子设备正朝着高性能化、高速度化以及高集成度化的方向发展, 因此, 高效散热问题亟待解决.微尺度通道内液体特殊的流动特性、尺度效应, 可集中散发大量热量, 为电子设备高效能散热开辟新的途径.文中针对金属微通道散热单元, 开展金属微通道结构UV-LIGA精密成形关键技术研究, 突破了大厚度胶膜图形制备和铜微结构精密电铸成型技术难点, 成功制备了特征宽度为100μm, 深宽比不小于5的铜质微通道基板样件, 实现金属微通道构件高效率、高质量成形.%With the use of wide band gap power chip, electronic equipment is developing towards the direction of high performance, high speed and high integration, while the problem of high-efficiency heat dissipation is urgent to be solved.The special flow characteristics and scale effect of liquid in the micro-channel can centrally distribute a large amount of heat, which opens up a new way for high-efficiency heat dissipation of electronic equipment.The key technology of UV-LIGA precision forming for metal micro-channel heat dissipation unit is studied in this paper, which breaks through the technical difficulties of large thickness film patterning and the precision electroforming of copper microstructures.Samples of copper micro-channel substrates with a characteristic width of 100μm and a depth to width ratio more than 5 has been successfully prepared, and high efficiency and high quality forming of metal micro-channel components has been realized.