HFCVD 硼掺杂复合金刚石薄膜的机械性能研究

摘要

综合不同种类单层金刚石薄膜的典型优点制备的复合金刚石薄膜具有优异的综合性能，本研究对比了 UMCD、BDMCD、UFGD 和两类新型硼掺杂复合金刚石薄膜的机械性能。研究结果表明：硼掺杂技术可有效改善金刚石薄膜的附着性能，因此 BDM-UMCD 和 BDM-UM-UFGCD 薄膜均具有较好的附着性能；表层为 UMCD 薄膜的 BDM-UMCD 薄膜(84.354 GPa)具有 UMCD 薄膜(82.058 GPa)表面硬度极高的优点，但是表面粗糙度较高(R a 304.41 nm)、表面可抛光性较差；相比之下，表层为 UFGD 薄膜的BDM-UM-UFGCD 薄膜则具有 UFGD 薄膜优异的表面光洁度(R a 104.71 nm)和表面可抛光性，此外由于硬度极高的中间层 UMCD 对于表层硬度的补充作用，该复合薄膜还具有相比于单层 UFGD 薄膜(67.925 GPa)而言较高的表面硬度(72.657 GPa)。%The composite diamond films combining typical merits of different types of monolayer diamond films show excellent comprehensive performance In this article mechanical properties of UMCD BDMCD UFGCD and two novel boron-doped composite diamond films were respectively evaluated and compared Research results showed that the boron doping technology could significantly improve the film-substrate adhesion so BDM-UMCD and BDM-UM-UFGCD films both presented favorable adhesive strength The surface layer of the BDM-UMCD film was UMCD layer consequently such the composite film had extremely high surface hardness 84 354 GPa similar to the monolayer UMCD film 82 058 GPa relatively high surface roughness R a 304 41 nm and bad polishability By contrast the BDM-UM-UFGCD film with the UFGD layer as the surface performed nice surface smoothness R a 104 71 nm and polishability as well as relatively higher surface hardness 72 657 GPa than the monolayer UFGD film 67 925 GPa attributed to the reinforcement effect of the ultra-hard middle UMCD layer.