电镀电流对镀镍金刚石性能的影响

摘要

Electrodeposition method was used to plate the surface of diamond with nickel . The effects of electroplating current on deposition rate of nickel plating on diamond surface , nickel plating layer density and impact toughness were discussed . The surface morphology of nickel coating was observed , and the compressive strength of nickel plated diamond was also discussed . The experimental results demonstrated that when plating current rose from 2 A to 6 A , the diamond′s nickel plating rate , impact toughness and compressive strength all increased as the current rose , and reached their maximum value at current of 6 A . The diamond surface coating became more uniform and the plating leakage reduced . Electroplating current could affect the bath temperature , which determined coating density . The microscopic strain of nickel plating layer was smallest and coating density achieved its maximum when the bath temperature was 50 ℃ .%为研究电镀电流对金刚石表面镀镍层沉积速率的影响，采用电沉积法对金刚石表面镀镍，并观察镀层的表面形貌，同时分析了电镀电流对镀镍金刚石镀镍层致密度、冲击韧性和抗压强度的影响。实验结果表明：当电镀电流从2 A 升至6 A ，随着电流增大，金刚石的镀镍层镀速、冲击韧性和抗压强度均随之增大，并在6 A 时达到最大；镀覆金刚石表面镀层均匀，且漏镀现象减少；电镀电流影响镀液温度，而镀液温度决定了镀层的致密度。电镀液温度处于50℃时，镀镍层显微应变最小，镀层的致密度达到最大。