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Low power, low phase noise CMOS ring oscillators.

机译:低功耗,低相位噪声的CMOS环形振荡器。

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摘要

The system-on-a-chip (SOC) movement demands increasingly greater levels of integration. In an effort to reduce part count, traditional implementations are being abandoned for integrated solutions. This presents numerous problems for wireless circuits. Radio frequency transceivers in particular consist of a veritable collage of incompatible technologies. For example, high efficiency power amplifiers are typically fabricated in alternative, high mobility semiconductors. High-Q resonators have also been traditionally implemented in a non-monolithic fashion, either with crystals or discrete inductors and capacitors. Efforts to move these components on chip have found some success but at a cost of large area consumption and reduced Q. Current research has focused on ring oscillators as an alternative approach. Historically, due to their poor noise performance, ring oscillators have found use only in low frequency applications such as clock recovery and skew reduction. Because of their relatively small footprint and ease of integration, efforts to improve ring oscillator noise performance have renewed.; This work contributes to complimentary metal-oxide-semiconductor (CMOS) ring oscillator design in several ways. First, an in-depth study of CMOS ring oscillator functionality and noise theory is provided. Second, from this discussion, noise minimizing design techniques are identified and a new Dual-Inverter Ring Oscillator (DIRO) is proposed. Third, in order to provide an accurate comparison between the new architecture and prior art, two other established ring oscillator topologies have been fabricated concurrently. This experiment eliminates any possibility of a process advantage. Each of these ring oscillators is comprehensively characterized in terms of intrinsic phase noise, power supply rejection and common mode rejection.; All ring oscillators were fabricated in a 0.18μm, 5-metal CMOS process. The proposed design has a measured frequency range of 650MHz–1040MHz using a supply voltage of 2.0V. The phase noise performance of the 2-stage DIRO oscillator at fosc = 913MHZ @600KHz offset is −16.55dBc/Hz while drawing 18.95mW.
机译:片上系统(SOC)运动要求越来越高的集成度。为了减少零件数量,传统的实现方式已被集成解决方案所取代。这为无线电路提出了许多问题。射频收发器特别是由一系列不兼容的技术组成。例如,通常在替代的高迁移率半导体中制造高效功率放大器。传统上,高Q谐振器也已以非单片方式实现,包括晶体或分立的电感器和电容器。在芯片上移动这些组件的努力已经取得了一些成功,但是付出了大面积消耗和降低Q的代价。当前的研究集中在环形振荡器作为一种替代方法。从历史上看,由于环形振荡器的噪声性能较差,因此仅在低频应用中使用,例如时钟恢复和偏斜减小。由于其相对较小的占地面积和易于集成,已经重新致力于改善环形振荡器的噪声性能。这项工作以多种方式有助于互补金属氧化物半导体(CMOS)环形振荡器的设计。首先,提供了对CMOS环形振荡器功能和噪声理论的深入研究。其次,从该讨论中,确定了噪声最小化设计技术,并提出了一种新的双反相环形振荡器(DIRO)。第三,为了提供新架构与现有技术之间的精确比较,同时制造了另外两个已建立的环形振荡器拓扑。该实验消除了工艺优势的任何可能性。这些环形振荡器中的每一个在固有相位噪声,电源抑制和共模抑制方面都有全面的特征。所有环形振荡器均采用0.18μm五金属CMOS工艺制造。拟议的设计使用2.0V的电源电压测得的频率范围为650MHz–1040MHz。 2级DIRO振荡器在f osc = 913MHZ @ 600KHz偏移时的相位噪声性能为-16.55dBc / Hz,而功耗为18.95mW。

著录项

  • 作者

    Badillo, Dean Adam.;

  • 作者单位

    Arizona State University.;

  • 授予单位 Arizona State University.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2003
  • 页码 174 p.
  • 总页数 174
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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