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Ion bombardment effects in low-pressure plasmas: In situ spectroscopic ellipsometry and Monte-Carlo simulation study.

机译:低压等离子体中的离子轰击效应:原位光谱椭圆偏振法和蒙特卡洛模拟研究。

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摘要

Plasma-enhanced chemical vapor deposition (PECVD) is a very versatile, yet highly complex process which has attracted the attention of the optical coatings community for its ability to synthesize thin film materials with a wide and continuous range of optical properties.; In this work, we investigate the effects of ion-surface interactions in the case of hyperthermal ions (100 to 103 eV) accelerated at the RF-biased electrode of a PECVD reactor, in order to better understand their effect beneath the substrate surface, on growing films, and on interface formation. We apply in situ real-time spectroscopic ellipsometry (RTSE): (1) to monitor modifications at the surface of model c-Si(001) substrates exposed to low-pressure O2 plasma at the RF-powered electrode as a function of substrate bias voltage (VB), (2) to determine interface broadening during the initial stages of TiO 2 deposition on SiO2, and (3) to monitor the Ar plasma treatment of the interface between porous and dense Si3N4 films, and its effect on the growth of multilayer dense/porous stacks.; The first part of this thesis focuses on the modifications of a c-Si substrate resulting from an exposure to an O2 plasma at the RF-powered electrode by using ex situ variable angle spectroscopic ellipsometry (VASE). The study demonstrates the presence of significant sub-surface modifications, giving rise to a top layer oxide (SiO 2) and an interfacial damage layer on c-Si(001). The depth of modifications was found to scale with ∼|VB|½ , increasing from ∼3.4 nm up to ∼9.6 nm for V B ranging between -60 and -600 V after 10 minutes of plasma exposure. Static Monte-Carlo TRIM simulations confirmed that the modifications and scaling can be explained on the basis of depth-dependent O transport by ion implantation.; In the second part of this work, we studied the dynamical effects of plasma-surface interactions by using in situ RTSE in combination with TRIDYN (a dynamical version of TRIM) simulations. TRIDYN simulations without any fitting parameter were found to be in excellent quantitative agreement with RTSE results. The modifications of c-Si are observed immediately following plasma ignition ( 1 s), with significant damage first observed after a fluence of ∼5x1014 O cm-2; the onset of oxidation is observed at a slightly higher fluence of ∼5x10 15 O cm-2. Modifications saturate at high fluence (∼10 17 O cm-2) where the depth of modifications converges towards the maximum ion penetration depth, leading to a steady-state modification structure as a result of the self-limiting oxide growth behavior. (Abstract shortened by UMI.)
机译:等离子体增强化学气相沉积(PECVD)是一种用途广泛但高度复杂的工艺,由于其能够合成具有广泛且连续光学特性的薄膜材料而引起了光学涂层界的关注。在这项工作中,我们研究了在PECVD反应器的RF偏置电极上加速的高温离子(100至103 eV)加速离子表面相互作用的影响,以便更好地了解它们在衬底表面下的影响。生长的薄膜,以及界面的形成。我们应用原位实时光谱椭偏仪(RTSE):(1)监视RF供电的电极在暴露于低压O2等离子体的c-Si(001)模型衬底表面上的修饰与衬底偏置的关系电压(VB),(2)确定在SiO2上TiO 2沉积初始阶段的界面展宽,以及(3)监测Ar等离子处理多孔和致密Si3N4膜之间的界面及其对Si3N4薄膜生长的影响多层致密/多孔堆叠。本文的第一部分着重于通过使用异位可变角度光谱椭圆偏振法(VASE)在射频供电的电极上暴露于O2等离子体而产生的c-Si基板的改​​进。研究表明存在明显的亚表面改性,在c-Si(001)上产生了顶层氧化物(SiO 2)和界面损伤层。发现在等离子暴露10分钟后,V B在-60至-600 V范围内,修饰深度与〜| VB | 1/2成比例,从〜3.4 nm增加至〜9.6 nm。静态蒙特卡洛TRIM仿真证实,可以根据离子注入对深度的依赖于O的迁移来解释这种修饰和定标。在这项工作的第二部分中,我们通过结合使用原位RTSE和TRIDYN(TRIM的动态版本)仿真研究了等离子体与表面相互作用的动力学效果。发现没有任何拟合参数的TRIDYN模拟与RTSE结果具有极好的定量一致性。等离子点火(<1 s)后立即观察到c-Si的修饰,注量约5x1014 O cm-2之后,首先观察到了显着的破坏。在〜5x10 15 O cm-2的通量稍高时观察到氧化的开始。修饰以高通量(〜10 17 O cm-2)饱和,在该处修饰深度收敛至最大离子渗透深度,由于自限氧化物生长行为,导致形成稳态修饰结构。 (摘要由UMI缩短。)

著录项

  • 作者

    Amassian, Aram.;

  • 作者单位

    Ecole Polytechnique, Montreal (Canada).;

  • 授予单位 Ecole Polytechnique, Montreal (Canada).;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 2006
  • 页码 212 p.
  • 总页数 212
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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