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Silicon carbide epitaxial layers grown on SiC wafers with reduced micropipe density

机译:在碳化硅晶片上生长的碳化硅外延层,微管密度降低

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The characteristics of SiC high-power devices are curently limited by the small area of the devices, which is usually less than 1 sq. mm. In order to increase device area, defect density in SiC epitaxial structures must be reduced. In this paper, we describe properties of silicon carbide epitaxial layers grown on 4H-SiC wafers with reduced micropipe density. These layers were grown by the vacuum sublimation method. Large area Schottky barriers (up to 8 mm~2) were fabricated on SiC epitaxial layers and characterized.
机译:SiC高功率器件的特性目前受到器件小面积(通常小于1平方毫米)的限制。为了增加器件面积,必须减小SiC外延结构中的缺陷密度。在本文中,我们描述了在具有降低的微管密度的4H-SiC晶片上生长的碳化硅外延层的特性。这些层通过真空升华法生长。在SiC外延层上制备了大面积肖特基势垒(最大8 mm〜2)并进行了表征。

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