首页> 外文会议>VLSI Design, Automation and Test, 2009. VLSI-DAT '09 >Segment based X-Filling for low power and high defect coverage
【24h】

Segment based X-Filling for low power and high defect coverage

机译:基于分段的X填充,可实现低功耗和高缺陷覆盖率

获取原文

摘要

Many X-Filling strategies are proposed to reduce test power during scan based testing. Because their main motivation is to reduce the switching activities of test patterns in the test process, some of them are prone to reduce the test ability of test patterns, which may lead to low defect coverage. In this paper, we propose a segment based X-filling(SBF) technique to reduce test power using multiple scan chains, with minimal impact on defect coverage. Different from the previous filling methods, our X-filling technique is segment based and defect coverage aware. The method can be easily incorporated into traditional ATPG flow to keep capture power below a certain limit and keep the defect coverage at a high level.
机译:提出了许多X填充策略来减少基于扫描的测试过程中的测试能力。由于它们的主要动机是减少测试过程中测试图案的切换活动,因此其中一些易于降低测试图案的测试能力,这可能导致缺陷覆盖率较低。在本文中,我们提出了一种基于段的X-filling(SBF)技术,以减少使用多个扫描链的测试能力,并且对缺陷覆盖率的影响最小。与以前的填充方法不同,我们的X填充技术基于片段并且知道缺陷覆盖率。该方法可以轻松地合并到传统的ATPG流程中,以将捕获功率保持在一定限度以下,并将缺陷覆盖率保持在较高水平。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号