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Incremental physical design method for flat SOC design

机译:平面SOC设计的增量物理设计方法

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摘要

SOC designs for consumer electronics often evolve generation by generation in a very short time. Besides the needs for merging more functionality, more and more enhancements are for the purpose of interface upgrading for new standards and better or faster signal processing hardware engines for video/audio encoding and decoding. Physical designs for these kinds of enhanced chips can reuse large potions of the previous layout and do not need to be re-implemented from the ground up to shorten the time to market. However, traditional physical incremental design method is becoming impractical, especially for the flat design, which usually can has the advantage of the smaller die size compared with the hierarchical design. In this paper, we propose an incremental physical design method to take the advantages of the hieratical design while maintaining the cost strength in the flat design. Our proposed method has been successfully applied to our next generation multimedia chip and the results show that no design iteration is needed and the run time is at least 5 times faster compared with the traditional method.
机译:消费电子产品的SOC设计通常会在很短的时间内一代又一代地发展。除了合并更多功能的需求之外,越来越多的增强功能还用于接口升级的新标准,以及用于视频/音频编码和解码的更好或更快的信号处理硬件引擎。这些类型的增强型芯片的物理设计可以重用以前布局的大部分,而无需从头开始重新实现以缩短上市时间。但是,传统的物理增量设计方法变得不切实际,尤其是对于平面设计而言,与分层设计相比,这种方法通常具有较小的管芯尺寸的优点。在本文中,我们提出一种增量物理设计方法,以利用层级设计的优势,同时保持平面设计的成本优势。我们提出的方法已经成功地应用于下一代多媒体芯片,结果表明,与传统方法相比,不需要设计迭代,并且运行时间至少快5倍。

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