School of Materials Science and Engineering, University of Science and Technology Beijing,Beijing 100083, China;
School of Materials Science and Engineering, University of Science and Technology Beijing,Beijing 100083, China;
School of Materials Science and Engineering, University of Science and Technology Beijing,Beijing 100083, China;
School of Materials Science and Engineering, University of Science and Technology Beijing,Beijing 100083, China;
School of Materials Science and Engineering, University of Science and Technology Beijing,Beijing 100083, China;
Cu interconnects; trench aspect ratio; microstructure; texture;
机译:沟槽长宽比对镶嵌铜互连件微观结构和织构的影响
机译:沟槽长宽比对沉积和退火的镶嵌铜互连线微观结构变化的影响
机译:退火,表面/应变能以及线宽与线间距比对镶嵌铜互连结构织构演变的影响
机译:长宽比和线间距对镶嵌铜互连中微结构的影响
机译:铜镶嵌互连中的织构和微观结构。
机译:铜双镶嵌互连的早期电迁移失败的紧凑模型
机译:大马士革铜互连线电迁移损伤的取向和微观结构依赖性