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Young's Modulus and Fracture Strength of Three Polysilicons

机译:三种多晶硅的杨氏模量和断裂强度

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摘要

Polysilicon specimens from Cronos, Sandia, and Standard MEMS, Inc. were tested in tension. The specimens were nominally 6 or 20 μm wide and 250 or 1000 μm long. The Cronos and the Standard MEMS specimens had thicknesses of 1.5, 2.0, and 3.5 μm; whereas, the Sandia specimens were all 2.5 μm thick. There was no dramatic difference in Young's modulus for the three materials. A total of 117 tests were run, and the average modulus for all three materials was 157 + 9 GPa. However, the strengths were quite different: 1.56 +- 0.25 GPa for the Cronos material, 2.85 +- 0.40 GPa for Sandia's, and 2.04 +-0.30 GPa for the SMI polysilicon.
机译:对来自Cronos,Sandia和Standard MEMS,Inc.的多晶硅样品进行了拉伸测试。标本的标称宽度为6或20μm,长度为250或1000μm。 Cronos和标准MEMS标本的厚度分别为1.5、2.0和3.5μm。而桑迪亚(Sandia)标本的厚度均为2.5μm。三种材料的杨氏模量没有显着差异。总共进行了117次测试,所有三种材料的平均模量均为157 + 9 GPa。但是,强度却大不相同:Cronos材料为1.56±0.25 GPa,Sandia's材料为2.85±0.40 GPa,SMI多晶硅为2.04 + -0.30 GPa。

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