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COUPLED FILLING AND COOLING ANALYSIS FOR INJECTION MOLDING

机译:注塑成型的耦合填充和冷却分析

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摘要

Conventional analysis such as MOLDFLOW divides the injection molding process into two different stages: filling and cooling. Filling analysis assumes both the cavity and core temperatures keeping constants during filling stage, while cooling analysis assumes the part temperatures in anywhere being constants. In this study, the temperatures between mold and part are assumed unknown and determined by solving both polymer and mold thermal problems. After ejection, the mold temperatures, inheriting from the last cycle, are memorized and used as the initial values for next cycle simulation. To keep the geometrical information consistency, both the part and mold are represented by solid models. The dual domains and conventional Galerkin methods are employed to solve the filling and cooling problems respectively. The coupled method can simulate the transient and more complicate thermal problems.
机译:诸如MOLDFLOW之类的常规分析将注射成型过程分为两个不同的阶段:填充和冷却。填充分析假定在填充阶段模腔和型芯温度均保持恒定,而冷却分析假定任何地方的零件温度均恒定。在这项研究中,假设模具和零件之间的温度未知,并且可以通过解决聚合物和模具的热问题来确定。脱模后,将从上一个循环继承的模具温度存储起来,并用作下一个循环模拟的初始值。为了保持几何信息的一致性,零件和模具均由实体模型表示。对偶域和常规Galerkin方法分别用于解决填充和冷却问题。耦合方法可以模拟瞬态问题,并使热问题更加复杂。

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