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Energy and temperature analysis in grinding

机译:磨削中的能量和温度分析

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摘要

Energy consumption and dissipation are discussed, leading into a thermal model for grinding. The analysis developed over many years applies to shallow-cut conventional grinding processes and also to deep grinding processes. Energy analysis provides insights into the grinding process and suggests avenues for process improvements. The thermal model provides a good estimation of contact temperatures as well as temperatures on the finish surface. Case studies are presented to demonstrate how operational efficiency, component quality and removal rates are affected by process conditions. Examples are included for High Efficiency Deep Grinding (HEDG). HEDG is defined as deep grinding at high workspeeds and very high removal rates. Tawakoli, Klocke The contact between the workpiece and wheel is represented as a circular arc. Experiments show that high removal rates and absence of thermal damage can be achieved. HEDG can achieve low specific grinding energy compared with shallow grinding and creep grinding. The chips take away most of the heat generated in the grinding process. As in creep grinding, burn-out of the coolant causes a steep rise in contact temperature of the workpiece.
机译:讨论了能耗和耗散情况,并建立了磨削的热模型。多年来开发的分析适用于浅切常规磨削工艺,也适用于深磨削工艺。能量分析提供了对研磨过程的见解,并为改进过程提供了建议。热模型可以很好地估算接触温度以及精加工表面的温度。案例研究表明了工艺条件如何影响运营效率,部件质量和去除率。实例包括高效深磨(HEDG)。 HEDG被定义为高工作速度和很高的去除率的深磨。 Tawakoli,Klocke工件和车轮之间的接触表示为圆弧。实验表明,可以实现高去除率和无热损伤。与浅磨和蠕磨相比,HEDG可以实现较低的比磨能量。切屑带走了研磨过程中产生的大部分热量。与蠕动研磨一样,冷却剂的耗尽会导致工件的接触温度急剧上升。

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