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Sublimation growth of 6H-SiC bulk

机译:6H-SiC块体的升华生长

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摘要

6H-SiC bulk crystals have been grown by sublimation method. We can mainly see two kinds of defects, planar defects and vertical defects in the wafers. The dependence of these defects in the wafers on two kinds of source materials and growth pressure is reported in this paper. The etch pits were classified into three sizes, i.e., Iarge(25~35μm), medium(15~20μm), small(~10μm). In the cross sectional view, some vertical defects disappeared at the planar defects in the middle of the grown layer. The relation between planar defects and vertical defects are discussed.
机译:6H-SiC块状晶体已经通过升华方法生长。我们主要可以看到晶片中的两种缺陷:平面缺陷和垂直缺陷。本文报道了晶圆中这些缺陷对两种源材料和生长压力的依赖性。腐蚀坑分为大(25〜35μm),中(15〜20μm),小(〜10μm)三种尺寸。在横截面图中,一些垂直缺陷在生长层中间的平面缺陷处消失了。讨论了平面缺陷和垂直缺陷之间的关系。

著录项

  • 来源
  • 会议地点 Kyoto(JP);Kyoto(JP)
  • 作者

    N.Takanaka; S.Nishino; J.Saraie;

  • 作者单位

    Faculty of Engineering and Design, Kyoto Institute of Technology Matsugasaki, Kyoto 606, Japan;

    Faculty of Engineering and Design, Kyoto Institute of Technology Matsugasaki, Kyoto 606, Japan;

    Faculty of Engineering and Design, Kyoto Institute of Technology Matsugasaki, Kyoto 606, Japan;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 TN304.12;
  • 关键词

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