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Reliability of Ti-based Gate Dielectrics on strained-Si0.91Ge0.09 and Ge under Dynamic and AC Stressing

机译:动态和交流应力下,应变Si0.91Ge0.09和Ge上的Ti基栅介质的可靠性

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摘要

The trapped charge distributions in Al/TiO2/GeOxNy/p-Ge and Al/rnTiO2/SiOxNy/strained-Si0.91Ge0.09 structures subjected dynamicrnstress of different amplitude and frequency in order to analyze therntransient response and the degradation of the oxide as a function ofrndifferent stress condition. The current transients and voltagerntransient observed in dynamic voltage (-4V to -9V) and currentrnstresses (-2.5mA/cm2 to -12.5mA/cm2) have been interpreted inrnterms of the charging/discharging of interface and bulk traps. Thernevolution of the current during unipolar voltage stresses shows therndegradation being much faster at low frequencies than at highrnfrequencies.
机译:Al / TiO2 / GeOxNy / p-Ge和Al / rnTiO2 / SiOxNy / strained-Si0.91Ge0.09结构中的电荷分布受到不同幅度和频率的动态应力,以分析瞬态响应和氧化物的降解。不同应力条件的作用动态电压(-4V至-9V)和电流应力(-2.5mA / cm2至-12.5mA / cm2)中观察到的电流瞬变和电压瞬变已被解释为界面陷阱和体阱陷阱的充放电。单极电压应力下电流的热演化表明,低频下的降解要比高频下的降解快得多。

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  • 会议地点 Honolulu HI(US);Honolulu HI(US)
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    Dept. of Electronics and ECE, Indian Institute of Technology Kharagpur, India e-mail: chandreswar@gmail.com Tel: +91-3222-281475 Fax: +91-3222-255303;

    rnDept. of Electronics and ECE, Indian Institute of Technology Kharagpur, India;

    rnMechanical Engineering Dept., Jadavpur University, Jadavpur, Kolkata 700032, India;

    rnDept. of Electronics and ECE, Indian Institute of Technology Kharagpur, India;

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