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Processing Technology of Ultra-thin Crystal Components

机译:超薄晶体零件加工技术

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摘要

With the Advancement of information industry, crystal materials have been widely applied in optical technology, electronic industry, high energy physics, etc. For high performance of optical devices, crystal wafer, the key element of optical-electric devices, has been demanded of high accuracy, super-smooth and undamaged crystal surface. It is very important to study and develop the key processing technology of ultra-thin crystal components. In this paper, the latest developments of the processing technology of several typical ultra-thin crystal components are discussed.
机译:随着信息产业的发展,晶体材料已被广泛应用于光学技术,电子工业,高能物理等领域。为了提高光学器件的性能,对晶体晶片是光电器件的关键元素提出了更高的要求。精确,超光滑且无损的晶体表面。研究和开发超薄晶体组件的关键加工技术非常重要。本文讨论了几种典型的超薄晶体组件加工技术的最新发展。

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