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CALIBRATION FOR THE MONTE CARLO SIMULATION OF ION IMPLANTATION IN RELAXED SIGE

机译:放松尺寸中离子注入的蒙特卡罗模拟的校准

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摘要

SiGe-based CMOS devices have significant performance enhancements compared to pure silicon devices. We have extended our Monte Carlo ion implantation simulator for Si_(1-x)Ge_x targets in order to study the formation of shallow junctions. SiGe has a larger nuclear and electronic stopping power for ion implanted dopants compared to pure silicon due to the heavier and electron-rich germanium. It turned out that the Lindhard correction parameter of the electronic stopping model can be adjusted by a linear function of the germanium content to adopt the strength of the electronic stopping. The successful calibration for the simulation of arsenic and boron implantations in Si_(1-x)Ge_x is demonstrated by comparing the predicted doping profiles with SIMS measurements. Thereby the non-linear shift towards shallower profiles with increasing germanium fraction is analyzed. Finally, the simulation result of source/drain implants for a MOS-transistor structure on a SiGe substrate is presented.
机译:与纯硅器件相比,基于SiGe的CMOS器件具有显着的性能增强。我们已经扩展了针对Si_(1-x)Ge_x目标的Monte Carlo离子注入模拟器,以便研究浅结的形成。与纯硅相比,SiGe具有更大的核注入和电子阻止能力,因为锗具有更重且富含电子的元素。事实证明,可以通过锗含量的线性函数来调整电子停止模型的Lindhard校正参数,以采用电子停止的强度。通过将预测的掺杂分布图与SIMS测量值进行比较,证明了Si_(1-x)Ge_x中砷和硼注入模拟的成功校准。因此,分析了随着锗含量增加,非线性向较浅轮廓变化的趋势。最后,给出了SiGe衬底上MOS晶体管结构的源/漏注入的仿真结果。

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