Progress on High Precision Maglev Stage Technology for Parallel High-Throughput Reflective Electron Beam Direct Write Lithography

摘要

REBL (Reflective Electron Beam Lithography) is a program for the development of a novel approach for high-throughput maskless lithography. The program at KLA-Tencor is funded under the DARPA Maskless Nanowriter Program. A DPG (digital pattern generator) chip containing over 1 million reflective pixels that can be individually turned on or off is used to project an electron beam pattern onto the wafer. The DARPA program is targeting 5 to 7 wafers per hour at the 45 nm node. This paper will describe a novel Maglev stage that enables this performance. The vacuum compatible rotary wafer stage has been developed in partnership with Philips.