Microvias - A New Cost-Effective Interconnection Technology

摘要

Microvias: A New Cost-Effective Interconnection Technology With the introduction of new component packages like Ball Grid Arrays, Chip Scale Packages and even Flip-Chips, the Printed Circuit Board is forced to adapt new technologies to connect these components. To benefit from the advantages these packages offer, is it a necessity to change the way, how a PCB or MCB-L is build. Using conventional board technology is technically viable but is commercially not justified. The reason for this is that we have reached the economical limits of drilling small holes (250 #mu#m). Taken into account that the hole density will double every three years the industry urges for a solution. A cost-effective solution has been found in the use of the Microvia technology. With this process it is possible to produce very small holes (50 #mu#m) in a high volume environment. Compared to other technologies like plasma- and photo-vias, the Microvias technique is backward compatible with today's PCB processes. Besides this advantage it has some other specific benefits over the other new interconnection techniques. This Microvia technology based on a laser process can be utilized in a way that it has some significant cost advantage over other technologies.