Electroconductive Paste Made Of Fine Copper Flakes Recently, silver through hole process has become popular as one of the methods of the two-sided PCBs. This process which consists of filling the PCB's holes with silver paste is an alternative to the ordinary copper plating through hole process. It has some advantages over the ordinary copper plating through hole process such as improved reliability, low cost, simple and easy technique and no need for waste water treatment. But, it also has some disadvantages, for instance, silver migration and precious metal consumption. Because of these reasons, copper had been tried for use an alternative to silver, but the fine copper flake production was very difficult and the copper powder got oxidized quite easily. These problems were solved by the following process.
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