Modern Fabrication Methods for Future Oriented Blind Via Multilayers

摘要

Modern Fabrication Methods for Future Oriented Blind Via Multilayers Circuit density gets even higher causing the designers of Printed Circuit Boards to search for more effective interconnect strategies. One of the most interesting areas of technological development is in the area of Blind and Buried Via Printed Circuits. The technology promises ease of manufacture higher packing density and almost certainly, a large step forward in proce/performance ratio. There has been much written and discussed on how such holes are created but little discussion with regard to what the whole process of manufactureing would look like for such boards. Special problems to be addressed are: centre dot Process flow alternatives centre dot Registration considerations centre dot Material stability considerations centre dot Imaging issues centre dot Hole formation alternatives The desire of the author is to present a general overview of process considerations and, at the same time, offer specific solutions to specific solutions to specific difficulties of producing Blind Via Multilayers.