Universal Coating Process for PCB's

摘要

Universal Coating Process for PCB's The universal coating process is finding a new method of coating rigid plates, particularly circuit boards. This method makes it possible to coat the surface of the printed circuit boards with screen-printable photoimageable etching-, plating- and solder resists in a range from 10 to 200 microns. Screen printingresists have a viscosity at room temperature form 10 to 20 Pas. At this consistency the resist is pored into tubs which are fixed on the top of the doctor rollers so that they are heatable up to 40 -60 degrees. This temperature reduce the viscosity to a value nearly 1 Pas. The application rollers are cooled down at a level of 10 to 20 degrees.